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2L-FCCL双面挠性覆铜板 2L-FCCL double-side flexible copper clad laminate英语短句 例句大全

时间:2020-05-03 23:50:50

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2L-FCCL双面挠性覆铜板 2L-FCCL double-side flexible copper clad laminate英语短句 例句大全

2L-FCCL双面挠性覆铜板,2L-FCCL double-side flexible copper clad laminate

1)2L-FCCL double-side flexible copper clad laminate2L-FCCL双面挠性覆铜板

2)FCCL without adhesive (2L-FCCL)无胶粘剂型挠性覆铜板(2L-FCCL)

3)flexible copper clad laminate挠性覆铜板

1.The application of the polyimiders to two-layerflexible copper clad laminate(2L-FCCL)was researched.用3-BAPP与多种二酐合成出多种聚酰亚胺,并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。

2.The current situation and development of halogen-freeflexible copper clad laminate were summarized, in which the halogen-free epoxy resins and the flame-retardant mechanism of phosphorated flame-retardant were introduced chiefly.介绍挠性覆铜板(FCCL)的现况及无卤化进展,重点阐述了常用的无卤环氧树脂和磷系阻燃剂的阻燃机理及其种类,并在此基础上浅述了未来的发展趋势。

英文短句/例句

1.Development and market distribution of 2L FCCL;浅述二层挠性覆铜板的进展及市场分布

2.The Synthesis of Phosphorous/Nitrogen-Containing Intumescent Flame Retardants and Their Application in FCCL挠性覆铜板用磷-氮系膨胀型阻燃剂的合成研究

3.Synthesis and Applied Research on Polyimide Used for 2-Layer Double-side Flexible Copper Clad Laminate二层法双面挠性覆铜板用热塑性聚酰亚胺的合成与应用研究

4.flexible copper-clad dielectric film挠性覆铜箔绝缘薄膜

5.Test methods for flexible copper-clad material for printed circuitsGB/T13557-1992印制电路用挠性覆铜箔材料试验方法

6.Flexible copper-clad polyimide film for printed circuitsGB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜

7.Flexible copper-clad polyester film for printed circuitsGB/T13556-1992印制电路用挠性覆铜箔聚脂薄膜

8.The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates;覆铜箔层压板专用环氧树脂的合成与性能

9.Study on New Technique and Properties of Electroplating Ni-Fe Alloys on Copper Plate for Continuous Casting Mold结晶器铜板镀覆Ni-Fe合金新工艺及性能研究

10.New Generation High Heat Resistance,High Modulus and Low CTE Copper Clad Laminates新一代高耐热性、高模量、低CTE覆铜箔层压板材料

11.epoxide woven glass fabric copper-clad laminates环氧玻璃布基覆铜箔板

12.ployester woven glass fabric copper-clad laminates聚酯玻璃布覆铜箔板

13.UV Blocking copper-clad laminates紫外线阻挡型覆铜箔板

14.metal core copper-clad laminate金属芯覆铜箔层压板

15.Review of the Development of Copper Clad Laminate from JPCA SHOW从JPCASHOW看覆铜板的发展

16.Research on Flexible Materials and Adhesives for Rigid-Flex Boards刚挠结合板用挠性材料和粘结材料性能研究

17.Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuitsGB/T16315-1996印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板

18.PEEK Film used in White Copper Clad Laminate for LED Chips--Review of Development About Special CCL(4)搭载LED的白色覆铜板用PEEK薄膜——特殊性能CCL的发展综述之四

相关短句/例句

FCCL without adhesive (2L-FCCL)无胶粘剂型挠性覆铜板(2L-FCCL)

3)flexible copper clad laminate挠性覆铜板

1.The application of the polyimiders to two-layerflexible copper clad laminate(2L-FCCL)was researched.用3-BAPP与多种二酐合成出多种聚酰亚胺,并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。

2.The current situation and development of halogen-freeflexible copper clad laminate were summarized, in which the halogen-free epoxy resins and the flame-retardant mechanism of phosphorated flame-retardant were introduced chiefly.介绍挠性覆铜板(FCCL)的现况及无卤化进展,重点阐述了常用的无卤环氧树脂和磷系阻燃剂的阻燃机理及其种类,并在此基础上浅述了未来的发展趋势。

4)FCCL挠性覆铜板

1.Synthesis of ingrain fireproofing polyacrylate and its adhesive inFCCL;本体阻燃丙烯酸酯胶粘剂的合成及其在挠性覆铜板中的应用

2.The polyimides applied to two-layer flexible copper clad laminate(2L-FCCL) were researched,the 2L-FCCL showes excellent solder resistance and low water-absorption.用BAB与多种二酐合成出多种聚酰胺酸,并在二层法挠性覆铜板(2L_FCCL)的应用方面做了一些探索。

3.A varnish used forFCCL was prepared with phosphorated epoxy resin, carboxyl-terminated acrlonitrile butadiene rubber(CTBN) and phosphorated flame retardant SPB-100.采用端羧基丁腈橡胶(CTBN)增韧改性含磷环氧树脂体系,配合使用添加型磷系阻燃剂SPB-100得到挠性覆铜板用胶液,以此制备的环保型挠性覆铜板不含卤素、锑和铅、汞、镉、六价铬等有害重金属,满足欧盟RoHS指令要求,板材剥离强度为1。

5)2L-FCCL二层挠性覆铜板

1.Based on the market status and technology trend of 2-layer flexible copper clad laminate(2L-FCCL),our work focus on lamination technique.针对二层挠性覆铜板(2L-FCCL)的市场现状和技术发展,我们的工作重点放在压合法。

2.This article mainly introduce the basic technical way and current primary achievement for the development of2L-FCCL.文章重点介绍开发二层挠性覆铜板的基本技术路线和目前的初步成果。

6)Halogen-Free FCCL无卤挠性覆铜板

延伸阅读

[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]分子式:C16H16ClN3O3S分子量:365.5CAS号:26807-65-8性质:暂无制备方法:暂无用途:用于轻、中度原发性高血压。

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