复合材料天线框架,the framework of composite antenna
1)the framework of composite antenna复合材料天线框架
2)PLA based scaffold material聚乳酸基复合框架材料
3)lead frame materials引线框架材料
1.With the development of IC to high density?miniaturization?low cost, the count of I/O increased, lead pitch decreased, which demand high strength?high conductivity forlead frame materials.引线框架材料是半导体元器件和集成电路封装的主要材料之一，其主要功能为电路连接、散热、机械支撑等。
2.The Effect oflead frame materials on interface microstructure between copper alloys and SnPb solder was investigated by means of optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy.结果表明,引线框架材料对铜合金与SnPb共晶焊料界面组织有很大的影响,焊点在160℃高温老化300 h后,CuCrZr系合金和CuNiSi合金与SnPb的界面金属间化合物为Cu6Sn5,其厚度在5~10 mm; 而C194合金与SnPb的界面金属间化合物为分布有Pb颗粒的Cu6Sn5,厚度已高达60~70 mm,同时还发现有微小空洞存在,影响焊点的可靠性。
英文短句/例句
1.Quantitative Metallography Analysis of Cu-Cr-RE Leadframe Material;铜铬稀土引线框架材料的定量金相分析
2.Specification of lead frames for plastic quad flat packageGB/T15876-1995塑料四面引线扁平封装引线框架规范
3.Specification of lead frames for plastic leaded chip carrier packagesGB/T16525-1996塑料有引线片式载体封装引线框架规范
4.Geometric and Material Nonlinear Analyses for Steel Framed Structures of Tall Buildings;高层建筑钢框架结构几何、材料非线性分析
5.dual in line lead frame双列直插式引线框架
6.A Disquisition On The Mothod Of Pre-plating Chemical Concentration Control引线框架电镀:预处理药品浓度对基材表面腐蚀的研讨
7.Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIPGB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
8.Dynamic Response of Asymmetrically Laminated Composite Frames非对称层合复合材料框架的动力响应
9.Specification of lead frames for small outline packageGB/T15878-1995小外形封装引线框架规范
10.Specification of DIP lead frames produced by etchingGB/T15877-1995蚀刻型双列封装引线框架规范
11.Blanking die design and manufacturing process for 10-SIP lead wire frame10-SIP引线框架冲切模具设计及工艺
12.core of plastic insulating material, for electrical windings or bobbins芯体,塑料绝缘材料制,绕组绕线架用
13.Finite Element Analysis and Behavior of Semi-rigid Steel Frames with for Non-linearity and Material Nonlinear;半刚接钢框架考虑几何非线性和材料塑性的有限元分析及性能探讨
14.The Study of Hyaluronic Acid Based Scanffold for Central Nervous System Tissue Engineering透明质酸基中枢神经组织工程框架材料的研究
15.Theoretical Framework of Cost Estimation in the Manufacturability of Advanced Composites先进复合材料可制造性中的成本估算理论框架
16.Hydrogen Storage in Nano Metal-Organic Framework Materials纳米金属有机框架材料的储氢性能研究
17.Research on reinforcing frame columns in concrete structures by outer section replacement with high strength materials高强材料置换截面加固混凝土框架柱的研究
18.Effect of Rare Earth on Oxidation Performance of Cu Alloys for Lead-frame;稀土对引线框架用铜合金氧化性能的影响
相关短句/例句
PLA based scaffold material聚乳酸基复合框架材料
3)lead frame materials引线框架材料
1.With the development of IC to high density?miniaturization?low cost, the count of I/O increased, lead pitch decreased, which demand high strength?high conductivity forlead frame materials.引线框架材料是半导体元器件和集成电路封装的主要材料之一，其主要功能为电路连接、散热、机械支撑等。
2.The Effect oflead frame materials on interface microstructure between copper alloys and SnPb solder was investigated by means of optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy.结果表明,引线框架材料对铜合金与SnPb共晶焊料界面组织有很大的影响,焊点在160℃高温老化300 h后,CuCrZr系合金和CuNiSi合金与SnPb的界面金属间化合物为Cu6Sn5,其厚度在5~10 mm; 而C194合金与SnPb的界面金属间化合物为分布有Pb颗粒的Cu6Sn5,厚度已高达60~70 mm,同时还发现有微小空洞存在,影响焊点的可靠性。
4)leadframe materials引线框架材料
1.With the development of IC to high density,multifunction and miniaturization,the amount of lead increase,and lead pitch space decreases,which demand high strength and excellent punchability forleadframe materials.随着集成电路向高集成度、多功能化和小型化方向发展,其引线数增多、引线间距减小,因此对引线框架材料的强度和冲裁加工性能提出了更高的要求。
5)C194 alloy for lead frameC194引线框架材料
1.Every step of the process for producingC194 alloy for lead frame is studied and analyzed with the result that suggestions and references for producing high qualityC194 alloy for lead frame are provided.对C194引线框架材料各个生产工序的生产工艺进行了分析和探讨,为生产出高质量的引线框架材料提供了有利的建议和参考。
6)lead frame material引线框架材料
1.The current status of research onlead frame materials used in integrated circuit is summarized in this paper.概述了目前集成电路用引线框架材料的一些研究进展,包括引线框架的功能、制备工艺、成分设计及其对材料的性能要求等,重点介绍了铜基引线框架材料的特性和研发动态,最后,提出了今后引线框架材料的研究方向。
2.KFC copper alloy is one of the representativelead frame materials with good electric conductivity.KFC合金是具有代表性的高导电引线框架材料之一。
3.Lead frame materials play a very important role in IC.引线框架材料在集成电路中起着固定芯片,保护内部元件,传递电信号并向外部散发热量的作用,是基础电路的关键部件,而作为引线框架材料用Cu-Cr-Zr合金,由于其能通过合理的形变热处理工艺改善组织、性能而获得高强高导性能,从而成为最具发展潜力的高性能铜合金材料。
延伸阅读
多孔羟基磷灰石陶瓷-聚乳酸复合材料分子式：CAS号：性质：有聚乳酸浸渍涂层的多孔羟基磷灰石(HA)复合材料。将多孔珊瑚状的HA陶瓷浸入DL-聚乳酸的丙酮溶液中(丙酮：聚乳酸=3:1～30:1)，取出干燥8～12h而制得。该复合材料较之未涂层材料，其压缩强度提高近4倍，压缩刚性提高30％，断裂吸收也提高30％左右。动物实验结果表明，这种复合材料已具有类似于来涂层的多孔HA陶瓷的成骨性能，但其初始强度已大大提高。
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