回流焊炉,Reflow Oven
1)Reflow Oven回流焊炉
1.Discussion on the Lead-free Measure ofReflow Oven回流焊炉的无铅化对策探讨
2)reflow oven回流焊炉，回溶焊炉
3)Parameters of reflow oven回流焊炉工艺参数
4)reflow soldering回流焊
1.Realization of minitype SMTreflow soldering oven s PID controller;小型SMT回流焊炉的PID控制实现
2.Effect ofreflow soldering on IMC and shear strength of SnAgCu solder joint回流焊对SnAgCu焊点IMC及剪切强度的影响
3.Design of Reflow Soldering temperature testing device回流焊温度测试装置的设计
英文短句/例句
1.Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint回流焊对SnAgCu焊点IMC及剪切强度的影响
2.At least3 years in design/ quality improvement for product such as re-flow oven, wave solder machine.至少3年以上回流焊、峰焊设计与质量改进经验。
3.Clear how to measuring reflow and wave profile.清楚怎样测量回流焊和波峰焊温度曲线。
4.Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;无铅回流焊冷却速率对焊点质量的影响
5.Effect of reflow soldering on the IMC and shear strength of Sn-0.3Ag-0.7Cu-xBi/Cu solder joints回流焊对SnAgCuBi/Cu焊点IMC及剪切强度的影响
6.The Design and Development of the Electrical Control System for SMT Solder-reflow Machines;SMT回流焊设备电控系统的设计开发
7.The Study on Computer Control System of Multitemperatual Zones Refolw Soldering;多温区回流焊计算机控制系统的研究
8.Development of precise inverter reflow-soldering power supply with waveform control波控逆变式精密回流焊接电源的研制
9.Analysis of thermal stress and hygrothermal stress for SiP device in reflow solderingSiP器件回流焊时湿热应力的分析
10.Are AOI/ AXI complementary methods, which include solder joint inspection, used for all reflowed parts?AOI/AXI的检验方法包括焊接点的检验,是否用于回流焊元件检测?
11.The most obvious is the necessity for increased reflow temperature.最明显的是，使用无铅锡膏必须提高回流焊温度。
12.Reflow Process Simulation for BGA Package by FEA;球栅阵列封装中回流焊工艺的有限元模拟
13.Software design of reflow soldering temperature measurement system based on VB基于VB的回流焊温度测试系统软件设计
14.Defect Analysis and Solutions for TAB Used in Two-times ReflowTAB在二次回流焊接中的缺陷分析及解决办法
15.Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?
16.Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。
17.Does the product Temperature Profile meet the reflow requirements for the SMT components according to the component manufactures?产品的温度曲线是否符合零件制造商提供的SMT零件回流焊要求?
18.Optimization and Control of Reflow Soldering Profile in SMT Line;表面贴装工艺生产线上回流焊曲线的优化与控制
相关短句/例句
reflow oven回流焊炉，回溶焊炉
3)Parameters of reflow oven回流焊炉工艺参数
4)reflow soldering回流焊
1.Realization of minitype SMTreflow soldering oven s PID controller;小型SMT回流焊炉的PID控制实现
2.Effect ofreflow soldering on IMC and shear strength of SnAgCu solder joint回流焊对SnAgCu焊点IMC及剪切强度的影响
3.Design of Reflow Soldering temperature testing device回流焊温度测试装置的设计
5)Reflow[英][ri:"fl?u][美][ri"flo]回流焊
1.5Cu were analyzed by scanning electron microscopy(SEM) and microscope,when reflows were carried out many times.结果表明:随着回流次数的增加,焊点的宽度和金属间化合物的厚度增加;焊料和凸点下金属化层(UBM)之间界面上的IMC组织从针状逐渐粗化;焊料的拉伸强度有轻微变化;断裂面第一次回流焊后出现在焊料中,而多次回流焊后断裂面部分出现在焊料中,部分出现在UBM和焊料的界面中。
2.The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
6)Reflow soldering回流焊接
1.Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package,PCB design,solder paste print,place BGA,and reflow soldering process.从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。
2.Reflow soldering is a key chain in the SMT ,the function of the reflow soldering stove is to provide a requested-temperature condition on which the solders is melt and then cooling and becomes solid to form a soldering drop.回流焊接是SMT工艺流程中重要的一环，回流焊炉的作用是提供一定的温度环境使焊锡膏熔化、而后降温固化在PCB上形成焊点。
延伸阅读
回流分子式：CAS号：性质：指在精馏操作中，从精馏塔顶部引出的上升蒸气经冷凝器冷凝后，一部分液体作为馏出液(塔顶产品)送出塔外，另一部分液体送回塔内，后者称为回流。塔顶的液相回流和塔釜(或再沸器)的蒸气流上升是保证精馏过程连续稳定进行的必要条件。
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